Electroplating system

ABSTRACT

An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.

BACKGROUND OF THE INVENTION a) Field of the Invention

The present invention relates to an electroplating system, and moreparticularly to an electroplating system in which the electric powerdistribution can be adjusted according to the shape of the product orthe configuration that the product is suspended and disposed.

b) Description of the Prior Art

It is well known that the electroplating process is a method of coatinga layer of membrane on an object using the electrolytic reductionreaction. The machine used in the electroplating process depends uponthe product to be electroplated, and no matter what kind of machine isused, the electroplating region is designed with a different number ofelectrode bars as the anodes, so as to result in the ionization of metalions in the electroplating solution; whereas, the workpieces to beelectroplated are usually designed as the cathodes.

When performing the electroplating operation, an electric voltage isapplied to the anodes and the cathodes respectively, allowing the metalions to be precipitated in the electroplating solution by theelectrolytic reaction. These metal ions will be deposited at the cathodeend, forming a metal coating which is plated on the surface of theworkpiece to be electroplated after being reduced at the cathodes. Theexisting electroplating system is divided into a soluble anodeelectroplating system and an insoluble anode electroplating systemdepending upon the method for providing the electroplating metal.

In the insoluble anode electroplating system, when the electric currentflows from the top of an anode to the bottom of the anode, the magnitudeof electric current will decrease gradually by the resistance. In otherwords, at the top of the anode, more metal ions will be decomposed andreleased as the electric current passing through this location islarger; on the other hand, the electric current passing through thelower part of the anode is less than the electric current passingthrough the upper part of the anode, thus fewer metal ions will bedecomposed and released, which then results in the phenomenon that theelectric lines of force do not distribute uniformly (i.e., the electriccurrent density does not distribute uniformly) in the electroplatingbath.

This phenomenon will cause that the product coating is thicker at theplace where the electric current density is large and the productcoating is thinner at the place where the electric current density issmall. Therefore, the quality of product (especially the sub-product)will be affected seriously as the surface coating on the product is notuniform. Furthermore, under some conditions, the product can be charredeasily as the electric current density is too large (the electric linesof force are too dense). Accordingly, it has long been an issue to besolved by the related industry to provide an electroplating system inwhich the electric power distribution can be adjusted depending upon theshape of the product or the configuration that the product is suspendedand disposed.

SUMMARY OF THE INVENTION

Accordingly, the primary object of the present invention is to providean electroplating system in which the electric power distribution can beadjusted depending upon the shape of the product or the configurationthat the product is suspended and disposed.

To achieve the abovementioned object, the electroplating system of thepresent invention includes an electroplating bath in which a cathode endand at least an anode end are disposed. The anode end is provided withplural anode elements which are insulative from one another. Inaddition, there are plural conductive elements which are connectedelectrically with each anode element, respectively.

By using the abovementioned structure features, in the electroplatingsystem according to the present invention, a variety of distribution ofthe electric lines of force is able to be formed in the electroplatingbath through energizing one or any number of anode elements. Inparticular, when the shape of the product to be electroplated or theconfiguration that the product is suspended and disposed is changed, thecorresponding distribution of the electric lines of force can be formedonly through a simple way of switching an electric current supplyingloop, without a need for changing the original anode end equipment.Therefore, the quality of electroplating can be improved by a moreaggressive and reliable means to result in good benefits.

In the electroplating system disclosed by the present invention, pluralanode elements, each of which is able to control the on or off of thecircuit, are used primarily, such that a variety of distribution of theelectric lines of force can be formed in the electroplating bath throughenergizing one or any number of anode elements. In particular, when theshape of the product to be electroplated or the configuration that theproduct is suspended and disposed is changed, the correspondingdistribution of the electric lines of force can be formed only through asimple way of switching an electric current supplying loop, without aneed for changing the original anode end equipment. Therefore, thequality of electroplating can be improved by a more aggressive andreliable means to result in good benefits.

To enable a further understanding of the said objectives and thetechnological methods of the invention herein, the brief description ofthe drawings below is followed by the detailed description of thepreferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a structural view of basic compositions of anelectroplating system, according to the present invention.

FIG. 2 shows a three-dimensional view of appearance of a firstembodiment of an anode end, according to the present invention.

FIG. 3 shows a structural schematic view of a second embodiment of theanode end, according to the present invention.

FIG. 4 shows a structural schematic view of a third embodiment of theanode end, according to the present invention.

FIG. 5 shows a structural schematic view of a fourth embodiment of theanode end, according to the present invention.

FIG. 6 shows a schematic view of a state of use of a fifth embodiment ofthe anode end, according to the present invention.

FIG. 7 shows a schematic view of a state of use of a sixth embodiment ofthe anode end, according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention provides primarily an electroplating system inwhich the electric power distribution can be adjusted according to theshape of the product or the configuration that the product is suspendedand disposed. As shown in FIG. 1, the electroplating system of thepresent invention comprises basically an electroplating bath 10 in whichan cathode end 20 and at least an anode end 30 are disposed, wherein theanode end 30 is provided with plural anode elements 32 which areinsulative from one another. In addition, there are plural conductiveelements 33 which are connected electrically with each anode element 32,respectively. Upon implementation, the said anode end 30 can be furtherprovided with a bracket 31, and each anode element 32 is disposed on thebracket 31, insulative from other anode elements 32.

In principle, when the electroplating system of the present inventionoperates practically, the anode ends 30 in pairs are disposedrespectively in the electroplating bath 10, opposite to two sides of thecathode end 20. The product to be electroplated, whereas, is suspendedon the cathode end 20. Therefore, when the electric current is appliedrespectively to the anode ends 30 and the cathode end 20, metal ionswill be precipitated and deposited on the cathode end 20 in theelectroplating solution in the electroplating bath 10 due to theelectrolytic reaction. When the metal ions are reduced on the cathode, ametal coating will be plated on the surface of the product.

As the electroplating system of the present invention is provided withplural anode elements 32, with each of which being able to control theon or off of the circuit, a variety of distribution of the electriclines of force can be formed in the electroplating bath 10 throughenergizing one or any number of anode elements 32. In particular, whenthe shape of the product to be electroplated or the configuration thatthe product is suspended and disposed is changed, the correspondingdistribution of the electric lines of force can be formed only through asimple way of switching an electric current supplying loop, without aneed for changing the original anode end equipment. Therefore, thequality of electroplating can be improved by a more aggressive andreliable means to result in good benefits.

Referring to FIG. 2, the said anode end 30 is provided with a bracket31, and each anode element 32 is disposed on the bracket 31, insulativefrom other anode elements 32. Under this configuration, each conductiveelement 33 can be also fixed on the bracket 31, and it is preferred thatan end of each conductive element 33 is extended out of the bracket 31by a predetermined length, which not only facilitates the installationof the entire anode ends 30, but also is easier to connect electricallythe conductive elements 33 with an external power source.

Referring to FIG. 3, the electroplating system of the present inventionfurther includes a distributor 40 to connect with the external powersource. The distributor 40 provides for connecting electrically with theconductive elements 33 disposed on the anode elements 32, and isprovided with plural switch circuits, each of which controls the on oroff of the circuit of each anode element 32. A preferred structureconfiguration is that the anode ends 30 are provided with a bracket 31,each anode element 32 is disposed on the bracket 31 and is insulativefrom other anode elements 32, each conductive element 33 is fixed on thebracket 31, and the distributor 40 is provided with plural lead wiresfor connecting electrically with each conductive element 33,respectively.

Under all kinds of the abovementioned structure patterns that can beimplemented, in the electroplating system of the present invention, thesaid each anode element 32 is provided with plural meshes 321. In otherwords, the said anode element 32 can manifest as a structure pattern ofa net or basket, so that the metal ions in the electroplating bath canhave a better fluidity.

In addition, in the embodiment as shown in FIG. 2, each said anodeelement 32 is provided with a rectangular outline. Upon implementation,each said anode element 32 can manifest as a circular outline as shownin FIG. 3, a square outline as shown in FIG. 4, or even an elliptic,triangular, trapezoidal or L-shaped outline as shown in FIG. 5. Whennecessary, the said each anode end 30 can be also provided with at leasttwo anode elements 32 in a different outline. Furthermore, as shown inFIG. 6, upon implementation, the said each anode end 30 can be furtherdisposed between an anode strip 50 and the cathode end 20 to assure thequality of electroplating. Or, as shown in FIG. 7, upon implementation,the said each anode end 30 can be disposed on the other side to theanode strip 50, opposite to the cathode end 20. Moreover, whennecessary, the cathode end 20, the anode ends 30 and the anode strips 50can be connected with a swinging device 70, thereby achieving an effectthat the coating is more uniform.

Specifically, in the electroplating system disclosed by the presentinvention, plural anode elements, each of which is able to control theon or off of the circuit, are used primarily to form a variety ofdistribution of the electric lines of force in the electroplating baththrough energizing one or any number of anode elements. In particular,when the shape of the product to be electroplated or the configurationthat the product is suspended and disposed is changed, the correspondingdistribution of the electric lines of force can be formed only through asimple way of switching an electric current supplying loop, without aneed for changing the original anode end equipment. Accordingly, thequality of electroplating can be improved by a more aggressive andreliable means to result in good benefits.

It is of course to be understood that the embodiments described hereinis merely illustrative of the principles of the invention and that awide variety of modifications thereto may be effected by persons skilledin the art without departing from the spirit and scope of the inventionas set forth in the following claims.

What is claimed is:
 1. An electroplating system comprising anelectroplating bath in which a cathode end and at least an anode end aredisposed, wherein each anode end is provided with plural anode elementswhich are insulative from one another, as well as plural conductiveelements which are connected electrically with each anode element,respectively.
 2. The electroplating system according to claim 1, whereinthe anode end is provided with a bracket and each anode element isdisposed on the bracket, insulative from other anode elements.
 3. Theelectroplating system according to claim 2, wherein the bracket isconnected with a swinging device.
 4. The electroplating system accordingto claim 1, wherein the anode end is provided with a bracket, each anodeelement is disposed on the bracket and is insulative from other anodeelements, and each conductive element is fixed on the bracket.
 5. Theelectroplating system according to claim 1, further comprising adistributor for connecting with an external power source, wherein thedistributor provides for connecting electrically with the conductiveelements disposed on each anode element and is provided with pluralswitch circuits, with each switch circuit controlling the on or off ofthe circuit of each anode element.
 6. The electroplating systemaccording to claim 1, further comprising a distributor for connectingwith an external power source, wherein the distributor provides forconnecting electrically with the conductive elements disposed on eachanode element and is provided with plural switch circuits, with eachswitch circuit controlling the on or off of the circuit of each anodeelement; each anode end being provided with a bracket and being disposedon the bracket, insulative from other anode ends; each conductiveelement being fixed on the bracket; the distributor being provided withplural lead wires, with each lead wire being connected electrically witheach conductive element.
 7. The electroplating system according to claim6, wherein the bracket is connected with a swinging device.
 8. Theelectroplating system according to claim 1, wherein each anode elementis provided with plural meshes.
 9. The electroplating system accordingto claim 1, wherein each anode element manifests a rectangular outline.10. The electroplating system according to claim 1, wherein each anodeelement manifests a circular outline.
 11. The electroplating systemaccording to claim 1, wherein each anode elements manifests a squareoutline.
 12. The electroplating system according to claim 1, whereineach anode element manifests an elliptic outline.
 13. The electroplatingsystem according to claim 1, wherein each anode element manifests atriangular outline.
 14. The electroplating system according to claim 1,wherein each anode element manifests a trapezoidal outline.
 15. Theelectroplating system according to claim 1, wherein each anode elementmanifests an L-shaped outline.
 16. The electroplating system accordingto claim 1, wherein each anode end is provided with two anode elementsin a different outline.
 17. The electroplating system according to claim1, wherein the electroplating system includes an anode strip.
 18. Theelectroplating system according to claim 17, wherein the anode end isfurther disposed between the anode strip and the cathode end.
 19. Theelectroplating system according to claim 17, wherein the anode end isdisposed on the other side of the anode strip, opposite to the cathodeend.
 20. The electroplating system according to claim 17, wherein theanode strip is connected with a swinging device.
 21. The electroplatingsystem according to claim 1, wherein the anode end is connected with aswinging device.
 22. The electroplating system according to claim 1,wherein the anode end and the cathode end are connected with a swingingdevice.
 23. The electroplating system according to claim 1, wherein thecathode end is connected with a swinging device.